? semiconductor components industries, llc, 2012 august, 2012 ? rev. 9 1 publication order number: mra4003t3/d mra4003t3g series, nrva4003t3g series surface mount standard recovery power rectifier sma power surface mount package features construction with glass passivation. ideally suited for surface mounted automotive applications. features ? compact package with j ? bend leads ideal for automated handling ? stable, high temperature, glass passivated junction ? nrva prefix for automotive and other applications requiring unique site and control change requirements; aec ? q101 qualified and ppap capable ? these devices are pb ? free and are rohs compliant* mechanical characteristics ? case: molded epoxy epoxy meets ul 94 v ? 0 @ 0.125 in ? weight: 70 mg (approximately) ? finish: all external surfaces are corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds in solder bath ? polarity: band in plastic body indicates cathode lead ? marking: mra4003t3g = r13 mra4004t3g = r14 mra4005t1g = r15 mra4005t3g = r15 mra4006t3g = r16 mra4007t3g = r17 nrva4004t3g = r14 nrva4005t3g = r15 nrva4006t3g = r16 NRVA4007T3G = r17 ? esd rating: ? human body model 3a ? machine model c *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. standard recovery rectifiers 1.0 amperes 300 ? 1000 volts case 403d sma marking diagram r1x fayww http://onsemi.com r1x = specific device code f = wafer source a = assembly location y = year ww = work week = pb ? free package see detailed ordering and shipping information in the ordering information section on page 4 of this data sheet. ordering information (note: microdot may be in either location)
mra4003t3g series, nrva4003t3g series http://onsemi.com 2 maximum ratings rating symbol value unit mra4003 mra4004/ nrva4004 mra4005/ nrva4005 mra4006/ nrva4006 mra4007/ nrva4007 peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 300 400 600 800 1000 volts avg. rectified forward current (at rated v r , t l = 150 c) i o 1 amp peak repetitive forward current (at rated v r , square wave, 20 khz, t l = 150 c) i frm 2 amps non ? repetitive peak surge current (surge applied at rated load conditions, halfwave, single phase, 60 hz) i fsm 30 amps storage/operating case temperature t stg , t c ? 55 to 150 c operating junction temperature t j ? 55 to 175 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. thermal characteristics characteristic symbol value unit thermal resistance, junction ? to ? lead (note 1) thermal resistance, junction ? to ? ambient (note 2) r jl r ja 16.2 88.3 c/w electrical characteristics characteristic symbol value unit t j = 25 c t j = 100 c maximum instantaneous forward voltage (note 3) (i f = 1 a) (i f = 2 a) v f 1.1 1.18 1.04 1.12 volts maximum instantaneous reverse current (at rated dc voltage) i r 10 50 a 1. minimum pad size 2. 1 inch pad size 3. pulse test: pulse width 250 s, duty cycle 2%. figure 1. typical forward voltage v f , instantaneous forward voltage (volts) 10 1.0 0.1 1.2 1.0 0.8 0.6 0.4 i f , instantaneous forward current (amp s figure 2. typical reverse current v r , reverse voltage (volts) 400 350 300 250 200 150 100 50 0 i r , reverse current (amps) 1.0e ? 9 0.01 10e ? 9 100e ? 9 1.0e ? 6 10e ? 6 100e ? 6 t j = 150 c 100 c 25 c ? 40 c t j = 150 c 100 c 25 c
mra4003t3g series, nrva4003t3g series http://onsemi.com 3 20 5 i pk /i o = figure 3. current derating per leg t l , lead temperature ( c) 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 160 140 120 100 60 40 20 0 i o , average forward current (amps) figure 4. forward power dissipation per leg i o , average forward current (amps) 2.0 1.5 1.0 0.5 0 1.4 1.2 1.0 0.8 0.6 0.4 0.2 p fo , average power dissipation (watts) 0 0 1.6 1.8 80 square wave dc 10 20 5 i pk /i o = square wave dc 10 freq = 20 khz figure 5. capacitance v r , reverse voltage (volts) 100 10 160 140 120 100 80 60 40 20 0 c, capacitance (pf) 1 200 180 t j = 25 c figure 6. thermal response t, time (s) 10e ? 3 100e ? 6 10e ? 6 0.001 r(t), transient thermal resistance 0.01 0.1 1.0 1e ? 3 (normalized) 1e+0 100e ? 3 10e+0 100e+0 1e+3 10e+3 r ja (1 inch pad board) r jl (min pad board) r jl(t) = r jl * r(t)
mra4003t3g series, nrva4003t3g series http://onsemi.com 4 ordering information device package shipping ? mra4003t3g sma (pb ? free) 5,000 / tape & reel mra4004t3g mra4005t1g 1,500 / tape & reel mra4005t3g 5,000 / tape & reel mra4006t3g mra4007t3g nrva4004t3g* nrva4005t3g* nrva4006t3g* NRVA4007T3G* ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *nrva prefix for automotive and other applications requiring unique site and control change requirements; aec ? q101 qualified and ppap capable.
mra4003t3g series, nrva4003t3g series http://onsemi.com 5 package dimensions sma case 403d ? 02 issue g 4.0 0.157 2.0 0.0787 2.0 0.0787 mm inches scale 8:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* dim a min nom max min millimeters 1.97 2.10 2.20 0.078 inches a1 0.05 0.10 0.20 0.002 b 1.27 1.45 1.63 0.050 c 0.15 0.28 0.41 0.006 d 2.29 2.60 2.92 0.090 e 4.06 4.32 4.57 0.160 l 0.76 1.14 1.52 0.030 0.083 0.087 0.004 0.008 0.057 0.064 0.011 0.016 0.103 0.115 0.170 0.180 0.045 0.060 nom max 4.83 5.21 5.59 0.190 0.205 0.220 h e e bd l c a a1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension b shall be measured within dimension l. polarity indicator optional as needed (see styles) h e on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other intellectual property. a list ing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parame ters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mra4003t3/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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